Rigid Flex SMT PCB Assembly 13 Layers Kaz Circuit 2 Layer PCB Fr4
PCB Assembly Service
Specifications:
- Material: Rigid-Flex
- Layer count:13 layers
- Board thickness: 1.6mm
- Copper thickness: 1oz
- Minimum drill size: 0.3mm
- Minimum trace & gap: 0.3mm
- Surface finish: HAL lead free
- Special technology: HDI, Rigid-Flex, blind via, Buried via
- Applications:Industry controller
Description:
- FR4 PCB#OEM #LCD Display#Electronic Circuit Board #Circuit
Assembly#PCBA #Multilayer PCB Assembly#PCBA Testing
- OEM/ODM,PCBA Manufacturing;Components sourcing&components
Alessembly
- Multilayer PCB#FR4 PCB#OEM# Electronic Circuit Board Assembly#
SMT#DIP#Components assembly#PCBA Testing
- SMT#DIP#AOI testing#X-Ray Testing# Printed Circuit Board#PCB
Assembly#PCBA Testing#Box Building
- FR4 PCB#Prototype Assembly#Small&Medium Volume&Hign
Mixed#Quick-Turn#PCB Assembly#Double-sided Printed Circuit Board
- Rigid-Flex Printed Circuit Board&Rigid Circuit Board#
Multilayer Printed Circuit Board# ENIG / HASL/OSP# Surface
treament.Components Sourcing#Components Assembly
- TQFP-64 &TQFP-48 *TO DIP& FR4 HDI Printed Circuit Boards
adapter Test Board
- Gold Plating Multilayer Pinted Circuit Boards Standalone Access
Controller Audio Extractor&NIAU Surfacce Treatment
What KAZ Circuit can do for you:
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Factory Introduction:
KAZ Circuit has been operating as a manufacturer of PCB&PCBA
since 2007. specialized in quick-turn manufacturing of prototypes
and small to middle volume series of rigid, flex, rigid-flex and
multilayer boards.as well as aluminium substrate circuit board.we
have a strong strength on fabrication of Roger board, MEGTRON
MATERIAL board and 2&3 steps HDI boards and etc.
Beside with six SMT production lines and 2 DIP lines.we provide
one-stop service to our customers as well.
Packing:Carton;P/P,Anti-static Bag.
SMT PCB assembly refers to the process of manufacturing a printed circuit board
(PCB) using surface mount technology, where electronic components
are placed and soldered directly to the PCB surface rather than
inserted through holes.
Key aspects of SMT PCB assembly include:
Component placement:
SMT components such as resistors, capacitors, integrated circuits
(ICs) and other surface mount devices are placed directly on the
PCB surface using automated pick and place machines.
Precise component placement is critical to ensure accurate
alignment and reliable electrical connections.
Solder paste deposition:
Solder paste is a mixture of solder alloy particles and flux that
is selectively deposited on the copper pads of a PCB using stencil
printing or other automated processes.
Solder paste acts as an adhesive and conductive material that will
form the electrical connection between the components and the PCB.
Reflow soldering:
After the components are placed, the PCB assembly goes through a
reflow soldering process that heats the board in a controlled
environment to melt the solder paste and form electrical and
mechanical connections between the components and the PCB.
Reflow profiles including temperature, time and atmosphere are
carefully optimized to ensure reliable solder joints.
Automatically detect:
After the reflow process, PCB assemblies are automatically
inspected using a variety of techniques, such as optical
inspection, X-ray inspection, or automated optical inspection
(AOI).
These inspections help identify and correct any problems such as
soldering defects, component misalignment or missing components.
Testing & Quality Control:
Comprehensive testing, including functional, electrical, and
environmental testing, is performed to ensure that PCB assemblies
meet required specifications and performance standards.
Implements quality control measures, such as statistical process
control and failure analysis, to maintain high manufacturing
standards and product reliability.
The advantages of SMT PCB assembly:
Higher Component Density: SMT components are smaller and can be placed closer together,
resulting in a more compact, smaller PCB design.
Improved reliability: SMT solder joints are more resistant to vibration, shock and
thermal cycling than through-hole connections.
Automated manufacturing: The SMT assembly process can be highly automated, increasing
production efficiency and reducing manual labor.
Cost-Effectiveness: SMT assembly can be more cost-effective, especially for high-volume production,
due to reduced material and labor costs.
SMT PCB assembly applications:
Consumer Electronics: Smartphones, Tablets, Laptops, and Other Portable Devices
Industrial electronics: control systems, automation equipment and power electronics
equipment
Automotive electronics: engine control units, infotainment and safety systems
Aerospace and defense: avionics, satellite systems and military equipment
Medical devices: diagnostic equipment, implantable devices and portable healthcare
solutions
SMT PCB assembly is a foundational technology used to produce compact, reliable,
and cost-effective electronic devices in a variety of industries.
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