4L FR4 Heavy Copper Printed Circuit Boards Green Soldermask White
Silkscreen PCB Assembly Service
Detail specification about Mobilephone Blue Soldermask White
Silkscreen FR4 Electronic Printed Circuit Board
| Categary | PCB |
| Layers | 2L |
| Material | FR-4 |
| Copper thickness | 1/1OZ |
| Board thickness | 1.6mm |
| Soldermask | Green |
| Quality standard | IPC Class 2, 100% E-testing |
| Certificates | TS16949, ISO9001, UL, RoHS |
Brief introduction about Shenzhen KAZ Circuit Co,. Ltd.
Brief introduction
Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA
custom-made manufacturer. It's commitment to high precision single,
double-sided, multilayer printed circuit board and metal substrate
circuit board production,which is a hightech enterprises including
amnufacture, sales, service and so on.
- We are confident to provide you quality products with
factory-directed price within the fastest delivery time!
What we can do for you
Prompt delivery: 2L: 3-5days
4L: 5-7days
24h/48h: urgent order
Company size: About 300 employees
What KAZ Circuit can do for you:
- PCB & PCBA Design
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Following are the key steps of
Heavy Copper PCB Assembly Service:
Materials and Components:
High Copper Content PCB (2oz, 4oz or 6oz copper thickness)
Heavy Electronic Components (e.g. Power Transistors, High Power
Resistors, Heat Sinks)
High Temperature Solder (e.g. High Melting Point Lead-Free Solder)
High Quality Solder Paste
PCB Assembly Process:
PCB Preparation:
Clean PCB surface thoroughly to remove any contaminants.
Apply solder mask and silk screen as per component placement
requirements.
Drill and through holes for component leads and mounting.
Component Placement:
Carefully place components on PCB ensuring proper orientation and
alignment.
Secure component leads to PCB pads using high temperature solder
paste.
Reflow Soldering:
Place assembled PCB in reflow oven or use hot air rework station.
Heat PCB to appropriate reflow temperature (usually 230°C to 260°C)
to melt solder paste.
Ensure proper solder wetting and joint formation for all component
connections.
Inspection and Testing:
Visually inspect the PCB for any solder bridges, cold joints, or
missing components.
Perform electrical tests to verify the functionality of the
circuit, such as continuity, resistance, and voltage measurements.
Perform any necessary functional tests to ensure the circuit meets
design specifications.
Thermal Management:
Identify high-power components that require additional cooling.
Install heat sinks or other thermal management solutions as needed
to effectively dissipate heat.
Ensure proper thermal interface between components and heat sink.
Conformal Coating (Optional):
Apply conformal coatings, such as acrylic or polyurethane, to
protect the PCB and components from environmental factors such as
moisture, dust, and corrosion.
Final Assembly and Packaging:
Secure the PCB in a suitable housing or enclosure, if required.
Pack the assembled PCB for safe shipping and delivery.
Key Considerations for Heavy Copper PCB Assembly:
Ensure the PCB material and copper thickness are appropriate for
the power requirements of the application.
Select components with appropriate power ratings and heat
dissipation capabilities.
Use high-temperature solder and solder paste to withstand higher
operating temperatures.
Implement proper thermal management solutions to prevent components
from overheating.
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