Multilayer PCB Circuit Board 4 Layers FR-4 Tg150 1.0mm ENIG 1U" PCB
Assembly Service
This is a 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper ENIG 1u"
multilayer PCB circuit board, detail specification as below, with
IPC Class 2 quality standard, panel size is 112.5*202mm .
- 4 layers
- FR-4 Tg150
- ENIG 1u"
- 1.0mm board thickness
- 1/H/H/1 oz.
- Green soldmask
- White silkscreen
- IPC Class 2
Manufacturing Capacity - Rigid PCB
| Item | Production Capacity |
| Type of Products | Single Sided, double sided & multilayer |
| Max Board Size | Single & Double Sided: 600*1500mm |
| Multilayer: 600*1,200 mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Golden Finger, etc. |
| Layers | 1~20 |
| Boad Thickness | 0.4~4.0mm |
| Base Copper | 18um(1/2oz), 35um (1oz), 70um (2oz), 105um (3oz), 150um (4oz),
300um (8oz) |
| Board Material | FR-4, Aluminum base, Polymide, copper base, ceramic base |
| Min Drilling Hole Size | 0.1mm |
| Min Line Width & Space | 0.075mm |
| Platting Gold | Nickle Plating Thickness 2.5~5um, gold thickness 0.05~0.1um |
| Tin Spraying | Tin thickness 2.5~5um |
| Milling Space | wire & edge: 0.15mm, hole & edge: 0.2mm, Contour Tolerance:
+/-0.1mm |
| Socket Chamfer | Angle: 30°/45°/60° Depth: 1~3mm |
| V-Cut | Angle: 30°/45°/60° Depth: 1/3 of board thickness, min aise: 80*80mm |
| On-Off Test | Max Testing Area: 400*1,200mm |
| Max Testing Point: 12,000 points |
| Max Testing Voltage: 300V |
| Max Insulation Resistance: 100mΩ |
| Impedance Control Tolerance | ± 10% |
| Soldering Endurance | 85℃~105℃ / 280℃~360℃
|
PCB size: 112.5*202mm / 25 UP
IPC Class 2 quality standard.
What KAZ Circuit can do for you:
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since
2007, also provide PCB Assembly service for our customers. Now with
about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We
are confident to provide you quality products with factory-directed
price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Multilayer PCB
Multilayer PCB is a printed circuit board made of more than two layers of copper
foil. It consists of an inner copper foil, an insulating substrate
and an outer copper foil, and the interconnection between the
layers is achieved by drilling and copper plating. Compared with
single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.
Advantages of multi-layer PCBs:
Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution
Composition of multi-layer PCBs:
Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric,
etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between
layers
Surface treatment: HASL, ENIG, OSP and other surface treatment
processes
Design and manufacture of multi-layer PCBs:
Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and routing
optimization
Process design: Aperture size, layer spacing, copper foil
thickness, etc.
Manufacturing process: Lamination, drilling, copper plating,
etching, surface treatment, etc.
More photoes for this 4 layers FR-4 Tg150 1.0mm 1/H/H/1 oz copper
ENIG 1u" multilayer PCB
KAZ Company information
Manufacturing Equipments - Rigid PCB
Product Applicances
Product Show - Rigid PCB
