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Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board

ShenZhen KaiZhuo Electronic Technology Co.,Ltd
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    Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers
     
    Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers
    • Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers
    • Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers
    • Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers
    • Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers
    • Buy cheap Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board from wholesalers

    Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board

    Ask Lasest Price
    Brand Name : KAZpcb
    Model Number : MPCB-B-001
    Certification : ISO9001 | UL ( E337072 ) | TS16949 ( 0259279 ) | RoHS
    Price : 0.1-3USD/pc
    Payment Terms : Paypal, T/T, Western Union
    Supply Ability : 10000-20000 square meters per month
    Delivery Time : 3-5days
    • Product Details
    • Company Profile

    Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board

    Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB


    Brief introduction

    ShenZhen KAZ Circuit Co.,LTD, mainly focus on PCB and PCBA for more than 10 years, is engaged in high precision single-sided, double-sided, multilayer printed circuit board and metal substrate circuit board production with rich-experience production team and timely delivery, and has approved ISO9001, SGS, ROHS, USA UL and TS16949 certification in succession.

    The Products in our company are custom-made based on the GERBER and BOM you provided.


    What KAZ Circuit can do for you:

    • PCB manufacturing (prototype, small to medium, mass production)
    • Components Sourcing
    • PCB Assembly/SMT/DIP


    To get a full quotation of the PCB/PCBA, pls provide the information as below:

    • Gerber File, with detail specification of the PCB
    • BOM List (Better with excel fomart)
    • Photoes of the PCBA (If you have done this PCBA before)

    Detailed specification

    Board materialFR-4
    Surface treatmentImmersion Gold/0.05-0.1um
    Board thickness1.6mm
    copper thickness1oz
    silkscreenWhite/Black
    soldermaskGreen/Blue/Black

    Manufacturer Capacity:

    CapacityDouble Sided: 12000 sq.m / month
    Multilayers: 8000sq.m / month
    Min Line Width/Gap4/4 mil (1mil=0.0254mm)
    Board Thickness0.3~4.0mm
    Layers1~20 layers
    MaterialFR-4, Aluminum, PI
    Copper Thickness0.5~4oz
    Material TgTg140~Tg170
    Max PCB Size600*1200mm
    Min Hole Size0.2mm (+/- 0.025)
    Surface TreatmentHASL, ENIG, OSP

    Multilayer PCB
    Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.


    Advantages of multi-layer PCBs:

    Higher wiring density and complex circuit design capabilities
    Better electromagnetic compatibility and signal integrity
    Shorter signal transmission paths, improved circuit performance
    Higher reliability and mechanical strength
    More flexible power and ground distribution


    Composition of multi-layer PCBs:

    Inner copper foil: Provides conductive layer and wiring
    Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
    Outer copper foil: Provides surface wiring and interface
    Perforated metallization: Realizes electrical connection between layers
    Surface treatment: HASL, ENIG, OSP and other surface treatment processes


    Design and manufacture of multi-layer PCBs:

    Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
    Layout and wiring: Reasonable layer allocation and routing optimization
    Process design: Aperture size, layer spacing, copper foil thickness, etc.
    Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.


    More photos

    Quality Multilayer FR4 Green Soldermask Immersion Gold High Precision Printed Circuit Boards PCB Multilayer PCB Board for sale
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