Double Sided FR4 HASL Lead Free Surface IPC Class 2 Printed Circuit
Boards
Detail Specifications:
- Layers: 2
- Material: FR-4
- Board thickness:1oz
- Copper thickness:1.6mm
- Surface treatment: ENIG
- Min drill hole: 0.15mm
- Min line track/space:0.15mm
- Soldmask color: green
- Silkscreen color: white
- Quality standard: IPC class 2
- Certifications: ISO9001, UL, RoHS Directive-compliant
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Printed circuit boards (PCBs) are the basic components of electronic equipment and are the
physical foundation that connects and supports various electronic
components. It plays a vital role in the functionality and
reliability of electronic systems.
Key aspects of electronic printed circuit boards include:
Layers and composition:
PCBs are typically made up of multiple layers, with the most common
being a 2- or 4-layer design.
These layers are made of copper serving as conductive paths and a
non-conductive substrate such as fiberglass (FR-4) or other
specialty materials.
Other layers may include power and ground planes for power
distribution and noise reduction.
Interconnects and Traces:
The copper layer is etched to form conductive traces that serve as
pathways for electrical signals and power.
Vias are plated-through holes that connect traces between different
layers, enabling multi-layer interconnections.
Trace width, spacing, and routing patterns are designed to optimize
signal integrity, impedance, and overall electrical performance.
Electronic component:
Electronic components, such as integrated circuits, resistors,
capacitors, and connectors, are mounted and soldered to the PCB.
The placement and routing of these components is critical to
ensuring optimal performance, cooling, and overall system
functionality.
PCB manufacturing technology:
PCB manufacturing processes typically involve steps such as
lamination, drilling, copper plating, etching and solder mask
application.
Advanced technologies such as laser drilling, advanced plating, and
multi-layer co-lamination are used in specialized PCB designs.
PCB Assembly & Soldering:
Electronic components are placed and soldered onto the PCB either
manually or automatically using techniques such as through-hole
soldering or surface mount soldering.
Reflow soldering and wave soldering are common automated processes
for connecting components.
Testing & Quality Control:
The PCB undergoes various testing and inspection processes such as
visual inspection, electrical testing, and functional testing to
ensure its reliability and performance.
Quality control measures, such as in-process inspections and
design-for-manufacturability (DFM) practices, help maintain high
standards in PCB production.
Electronic PCBs are used in a wide variety of applications, including consumer
electronics, industrial equipment, automotive systems, medical
devices, aerospace and telecommunications equipment, and more.
Continuing advances in PCB technology, such as the development of
high-density interconnect (HDI) PCBs and flexible PCBs, have
enabled the creation of smaller, more powerful, and more
energy-efficient electronic devices.
More photoes of double sided FR4 1.6mm 1oz HASL Lead Free PCB from
experienced PCB manufacturer
