Rogers and FR4 Multilayer PCB Circuit Board Gold Plating Edge PCB
Assembly Service
Specificaiton:
| Layers | 4 |
| Material | FR-4 |
| Board Thickness | 1.6mm |
| Copper Thickness | 1oz |
| Surface Treatment | ENIG |
| Soldmask & Silkscreen | Green & White |
| Quality Standard | IPC Class 2, 100% E-testing |
| Certificates | TS16949, ISO9001, UL, RoHS |
Our service are as following:
1. Offer service for PCB and PCBA design
2. Offer service for purchasing components according to your PCBA
boom list
3. Producing PCB according to your gerber file
4. Offer SMT service for your PCBA
5. No limit quantity
6. Supplying of small volume production
7. Quick turn is available
- Product performance
- Prompt delivery
- Quality approvals
- Reputation
- Service
- Small orders accepted
- Brand-name parts
- Country of origin
- Distributorships offered
- Electronic link
- Experienced staff
- Form A
- Green product
- Guarantee/warranty
- Product features
- International approvals
- Military specifications
- Packing
What KAZ Circuit can do for you:
- PCB manufacturing (prototype, small to medium, mass production)
- Components Sourcing
- PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
- Gerber File, with detail specification of the PCB
- BOM List (Better with excel fomart)
- Photoes of the PCBA (If you have done this PCBA before)
Multilayer PCB
Multilayer PCB is a printed circuit board made of more than two layers of copper
foil. It consists of an inner copper foil, an insulating substrate
and an outer copper foil, and the interconnection between the
layers is achieved by drilling and copper plating. Compared with
single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.
Advantages of multi-layer PCBs:
Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution
Composition of multi-layer PCBs:
Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric,
etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between
layers
Surface treatment: HASL, ENIG, OSP and other surface treatment
processes
Design and manufacture of multi-layer PCBs:
Circuit design: Signal integrity, power/ground integrity design of
multi-layer boards
Layout and wiring: Reasonable layer allocation and routing
optimization
Process design: Aperture size, layer spacing, copper foil
thickness, etc.
Manufacturing process: Lamination, drilling, copper plating,
etching, surface treatment, etc.
More Photoes
