Multilayer Electronic Printed Circuit Board Gold Plating Surface
Finishing
Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
PCB Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP |
| Max. component height::25mm |
| Max. PCB size:680×500mm |
| Min. PCB size:no limited |
| PCB thickness:0.3 to 6mm |
| PCB weight:3KG |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited |
| Component height:Top 120mm/Bot 15mm |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum |
| Surface Finish:plating Au, plating sliver , plating Sn |
| Air bladder rate:less than20% |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
Printed circuit boards (PCBs) are the basic components of electronic equipment and are the
physical foundation that connects and supports various electronic
components. It plays a vital role in the functionality and
reliability of electronic systems.
Key aspects of electronic printed circuit boards include:
Layers and composition:
PCBs are typically made up of multiple layers, with the most common
being a 2- or 4-layer design.
These layers are made of copper serving as conductive paths and a
non-conductive substrate such as fiberglass (FR-4) or other
specialty materials.
Other layers may include power and ground planes for power
distribution and noise reduction.
Interconnects and Traces:
The copper layer is etched to form conductive traces that serve as
pathways for electrical signals and power.
Vias are plated-through holes that connect traces between different
layers, enabling multi-layer interconnections.
Trace width, spacing, and routing patterns are designed to optimize
signal integrity, impedance, and overall electrical performance.
Electronic component:
Electronic components, such as integrated circuits, resistors,
capacitors, and connectors, are mounted and soldered to the PCB.
The placement and routing of these components is critical to
ensuring optimal performance, cooling, and overall system
functionality.
PCB manufacturing technology:
PCB manufacturing processes typically involve steps such as
lamination, drilling, copper plating, etching and solder mask
application.
Advanced technologies such as laser drilling, advanced plating, and
multi-layer co-lamination are used in specialized PCB designs.
PCB Assembly & Soldering:
Electronic components are placed and soldered onto the PCB either
manually or automatically using techniques such as through-hole
soldering or surface mount soldering.
Reflow soldering and wave soldering are common automated processes
for connecting components.
Testing & Quality Control:
The PCB undergoes various testing and inspection processes such as
visual inspection, electrical testing, and functional testing to
ensure its reliability and performance.
Quality control measures, such as in-process inspections and
design-for-manufacturability (DFM) practices, help maintain high
standards in PCB production.
Electronic PCBs are used in a wide variety of applications, including consumer
electronics, industrial equipment, automotive systems, medical
devices, aerospace and telecommunications equipment, and more.
Continuing advances in PCB technology, such as the development of
high-density interconnect (HDI) PCBs and flexible PCBs, have
enabled the creation of smaller, more powerful, and more
energy-efficient electronic devices.
PCB Pictures
